Capability
| RIGID PCB | |
| Item | Capability |
| Max Layer Count | 30L |
| Max Board Thickness | 8.0mm |
| Max Aspect Ratio | 12:01 |
| Max Copper Thickness | 10oz |
| Max Working Panel Size | 2000*610mm |
| Min 4L Board Thickness | 0.32mm |
| Mechanical Hole/Land | 0.15/0.35mm |
| Hole Registration Accuracy | +/-0.05mm |
| Hole Size Tolerance of PTH | +/-0.05mm |
| Min Trace Width/Space | 0.075/0.075mm |
| Surface Treatment | HASL（LF HASL)、OSP、HARD GOLD、ENIG、Immersion Tin/Ag |
| HDI PCB | |
| Item | Capability |
| Min Trace Width/Space | 0.065/0.065mm |
| Min Trace Tolerance | +/-15% |
| Min Micro-Via | 0.10mm |
| Min Target Pad Size | 0.25mm |
| PTH & Buried Drill Size | 0.20mm |
| PTH Pad Size | 0.35mm |
| Aspect Ratio of Blind Hole | 0.042361111 |
| Max Build-up Layer Count Per side | 3+N+3 |
| Solder Mask Clearance | 0.035mm |
| Solder Mask Dam | 0.065mm |
| Min CSP/BGA Pitch | 0.50mm |
| Impedance Control | +-/5ohm |
| Surface treatment | HASL（LF HASL)、OSP、HARD GOLD、ENIG、Immersion Tin/Ag |
| FLEX PCB | |
| Item | Capability |
| Max Board Size | 2000*240mm |
| Max Layer Count | 10L |
| Min Trace Width/Space(1/4oz) | 0.04mm |
| Min Trace Width/Space(1/3oz) | 0.05mm |
| Min Trace Width/Space(1/2oz) | 0.055mm |
| Min Through-Hole Diameter | 0.15mm |
| Min Laser-Via Diameter | 0.10mm |
| Min Pad | 0.25mm |
| Coverlayer Registration Tolerance | 0.15mm |
| Outline Tolerance | 0.05mm |
| Min Purched Slot Width | 0.6mm |
| Pitch Tolerance | +-/0.05mm |
| Rigid-Flex Capability | Yes |
| Air Gap Capability | Yes |
| Surface treatment | OSP、HARD GOLD、ENIG |
